Focus on electronics

1. Solder ball holder for CSP/WLP
2. Microfabrication of RF packaging devic
3. Microstructures for microfluidic device

1. Solder ball holder for CSP/WLP
MEMSware is in development of micro-ball arrangement plate for supporting CSP(Chip Scale Packaging), BGA(Ball Grid Array) and WLP(Wafer Level Packaging) technologies. With our arrangement plate, much finer packaging of chips is possible(even to ball mounter with ball size

Fig. 1 Schematic of solder ball holder

2. Microfabrication of RF packaging device
Via-hole formation and metal filling is possible on non-conductive(glass) package board. It shows a possible solution for the problems of overheating and signal loss of ultra high frequency RF systems.

Fig. 2 Metallized microholes for RF application

3. Microstructures for microfluidic device
The metal layer for inkjet nozzle developed by 3D micromachining and microelectroforming technology has benefits of stress-free state in end product and capability of being continuously manufactured.

Fig. 2 Metallized microholes for RF application